IEEE/CAA Journal of Automatica Sinica被SCI,，EI，Scopus，DBLP等数据库收录，入选中国科技期刊卓越行动计划世界一流重点建设期刊、中国科协自动化领域T1级高质量科技期刊、计算领域高质量科技期刊T1类（最顶级）、中国科技核心期刊、ESI刊源期刊，自首次参评以来已连续五年荣获“中国最具国际影响力学术期刊”称号（Top5%）。

IEEE/CAA Journal of Automatica Sinica是中科院期刊分区工程技术和计算机科学类一区Top期刊；2021年SCI影响因子7.847，在自动化与控制领域排名全球第7（前10%)，是该领域唯一的中国主办Q1区SCI期刊；2021年CiteScore为13.0，在控制与优化领域排名全球第1，在计算机信息系统、控制与系统工程、人工智能领域分别排名前5%-7%，均位于Q1区前列，；全球TOP1000期刊榜单计算机与电子领域排名世界前12%、中国第1；谷歌学术计量自动化与控制理论学科顶级出版物中排名全球第7，是该学科TOP20出版物中世界最年轻且唯一中国主办的期刊。

期刊主页：https://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6570654/ 

https://www.ieee-jas.net

在线投稿：https://mc03.manuscriptcentral.com/ieee-jas

编委会：https://www.ieee-jas.net/news/Current.htm

联系方式

联系人：欧彦

电话：010-82544459

email：yan.ou@ia.ac.cn     

主编   

Qing-Long Han   Swinburne University of Technology, Australia

副主编  

Derong Liu   Guangdong University of Technology, China    

Zhongping Jiang   New York University, USA    

Qinglai Wei    Chinese Academy of Sciences, China    

编委

Cesare Alippi   Politecnico di Milano, Italy

Panos J. Antsaklis   University of Notre Dame, USA

Tamer Basar   University of Illinois, USA

Dimitri P. Bertsekas   Massachusetts Institute of Technology, USA

Bijnan Bandyopadhyay  Indian Institute of Technology Bombay, India

Zhengcai Cao   Beijing University of Chemical Technology, China

Long Chen   University of Macau, Macau

C. L. Philip Chen   University of Macau, Macau

Mo-Yuen Chow  Shanghai Jiaotong University, China

L. Chen  Sun Yat-sen University, China

Weiping Ding   Nantong University, China

Daoyi Dong   University of New South Wales, Australia

Giuseppe Franzè   University of Calabria, Italy

Shangce Gao University of Toyama, Japan

Weinan Gao Florida Institute of Technology, USA

Fengling Han   Royal Melbourne Institute of Technology, Australia

Wei He   University of Science & Technology Beijing, China

Zengguang Hou   Chinese Academy of Sciences, China

Tingwen Huang  Texas A&M University at Qatar, Qatar

Biao Huang  University of Alberta, Canada

Frank L. Lewis   The University of Texas at Arlington, USA

Hongyi Li  Guangdong University of Technology, China

Shuai Li   Swansea University, UK

Chenglin Liu    Chinese Academy of Sciences, China

Honghai Liu  University of Portsmouth, UK

Lichuan Liu   Northern Illinois University, USA

Xiaoping Liu    Carleton University, Canada

Yan-Jun Liu    Liaoning University of Technology, China

Xin Luo    Chinese Academy of Sciences, China

Yan Lu   NIST, USA

Antonio Marcus Nogueira Lima  Universidade Federal de Campina Grande, Brazil

Xiaoxiang Na   University of Cambridge, UK

Thomas Parisini   University of Trieste, Italy

Marios M. Polycarpou    University of Cyprus, Cyprus

Xuemin Shen   University of Waterloo, Canada

Jinhua She  Tokyo University of Technology, Japan

Lei Shu    University of Lincoln, UK

Zhen Song   Siemens Corporation, USA

Fei-Yue Wang    Chinese Academy of Sciences, China

Jiacun Wang   Monmouth University, USA

Shouguang Wang  Zhejiang Gongshang University, China

Zidong Wang   Brunel University London, UK

Donald C. Wunsch II   Missouri University of Science and Technology, USA

Yang Xiang  Swinburne University of Technology, Australia

Peter Xiong   Microsoft, USA

Tao Yang  Northeastern University, China

Hui Yu  Pouthmoth University, UK

Huaguang Zhang  Northeastern University, China

Jun Zhang   Denver University, USA

Nian Zhang   University of the District of Columbia, USA

Jinyun Zhang   Mitsubishi Electric Research Laboratories, USA

Mengchu Zhou  New Jersey Institute of Technology, USA